| abstract |
When performing electroless nickel-palladium-gold plating on a surface to be plated such as a terminal portion of a printed wiring board, a terminal portion of another electronic component, or a resin substrate with other metal fine pattern, Provided is a method in which abnormal metal deposition on the resin surface as a base is suppressed and the quality of the plated surface is excellent. Furthermore, the present invention provides a plated product excellent in the quality of the plated surface, particularly an interposer, a mother board, and a semiconductor device using them. A method of performing electroless nickel-palladium-gold plating of a substrate with a metal fine pattern on a portion to be treated such as a terminal portion of a printed wiring board, wherein the electroless palladium plating treatment is performed after the step of applying a palladium catalyst. In an arbitrary stage before performing, at least one surface treatment selected from the group consisting of treatment with a solution having a pH of 10 to 14 and plasma treatment is performed. [Selection] Figure 3 |