| abstract |
Disclosed is a curable resin composition that can improve the developability of through holes and suppress development residues, and can obtain good heat resistance and hardness in a cured product. A curable resin composition according to the present invention includes a carboxylic acid-containing resin, a photopolymerization initiator, a dispersant and / or a block copolymer, a graft polymer, and a star polymer structure having an acidic group in advance. It contains barium sulfate treated with a dispersant having at least one of them. [Selection figure] None |