| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fbcd2a70a3c49d0aed69a000d55909 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
2009-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96f9bd6339b14bd7983c327459143d68 |
| publicationDate |
2011-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011052036-A |
| titleOfInvention |
Curing agent for epoxy resin |
| abstract |
PROBLEM TO BE SOLVED: To provide a curing agent for epoxy resin which has a difference in curing performance of epoxy resin at around 150 ° C and around 200 ° C and can selectively cure epoxy resin at around 200 ° C. To do. An epoxy resin curing agent comprising a compound (X) having a phosphonate anion. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10162017-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9151807-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9735773-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8818749-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10520559-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10746818-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8542010-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9201122-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9638764-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10725100-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11630130-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10107873-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10254354-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11169223-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8692546-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9645220-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8680846-B2 |
| priorityDate |
2009-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |