| abstract |
A multi-chip module in which the influence of heat is reduced is provided. A silicon interposer 20 having a wiring pattern 26a disposed on a base substrate 10 and an adhesive sheet that bonds the base substrate and the silicon interposer while maintaining electrical connection between the base substrate and the silicon interposer. 18, and the relationship between the expansion coefficient α of the silicon interposer, the expansion coefficient β of the base substrate, and the expansion coefficient γ of the adhesive sheet is α <γ <β. Thereby, the adhesive sheet absorbs the thermal expansion difference between the silicon interposer and the base substrate. [Selection] Figure 1 |