| abstract |
[PROBLEMS] To provide a resin composition having good reflow peeling resistance because it has a low elastic modulus and sufficient low-stress property and excellent adhesive properties even when a filler is contained in a high proportion, and die attach for semiconductors. A semiconductor device having excellent reliability by being used as a paste or a heat radiation member bonding material is provided. A thermosetting resin (A), a filler (B), and a predetermined general formula (1) are provided. A resin composition comprising a compound (C), wherein in the compound (C), the proportion of the compound wherein n is 4 or more in the general formula (1) is X%, and the predetermined general formula contained in the compound (C) (2) When the ratio of the compound shown by Y2 is set to Y%, X and Y satisfy | fill the following relational expression 1, The resin composition characterized by the above-mentioned. [Relational expression 1: Y <−2.7 × 10 −3 X + 0.8] [Selection] Figure 1 |