| abstract |
PROBLEM TO BE SOLVED: To form a conductive film by heating at a temperature at which a non-heat resistant base material made of a general-purpose resin or paper can be used without using highly dangerous hydrogen gas in the conductive film forming process A composition for formation and a method for forming a conductive film using the composition are provided. A conductive film-forming composition containing noble metal fine particles, copper ions, a reducing agent, and monoamines is applied to a base material, and heated in a non-oxidizing atmosphere to form the conductive film on the base material. Form. [Selection figure] None |