Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
filingDate |
2009-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22f4a542ac60a13ef8ece7d285110470 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d307631ead399dc2570c3dc57cdb1e4 |
publicationDate |
2011-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2011032538-A |
titleOfInvention |
Electroless plating method |
abstract |
In an electroless plating method in which a plurality of single-wafer substrates are accommodated in a rack and immersed in a chemical solution for each rack, an electroless plating method that does not cause uneven plating due to insufficient draining is provided. After immersing a rack 200 containing a plurality of single-wafer substrates 100 in a chemical solution, at least two or more of the substrates arranged substantially evenly are pulled up substantially perpendicular to the chemical surface from the chemical solution. In addition, an electroless plating method characterized in that air is blown from the blower mechanism 300 substantially parallel to the substrate surface. [Selection] Figure 5 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140055995-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190110077-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150141130-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10435778-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9359676-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9120113-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102202880-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140027876-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016018847-A |
priorityDate |
2009-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |