Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 |
filingDate |
2009-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e8f21d794e94dcff0b58402002ce88e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43865c420f84df6cbbea8f7b0d053979 |
publicationDate |
2011-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2011032434-A |
titleOfInvention |
Sheet-like epoxy resin composition for electronic component sealing, electronic component device assembly and electronic component device obtained thereby |
abstract |
An electronic component sealing sheet-like epoxy resin composition that reduces warping of a substrate after sealing even if the sealing area is large, and an electronic component mounted on the substrate using the same An electronic component device assembly is provided. An electronic component in which an epoxy resin composition containing the following components A to E is molded into a sheet, and the content of component C is 15 to 30% by weight of the entire epoxy resin composition It is a sheet-like epoxy resin composition for sealing. And it is an electronic component device assembly formed by sealing a plurality of electronic components. A: Epoxy resin containing acetal group B: Phenol resin C: Elastomer D: Inorganic filler E: Imidazole compound [Selection] FIG. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10128131-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018044177-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018105662-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014080489-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016072236-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I756318-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015103572-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018105662-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015076088-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015178635-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11049825-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7135864-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014131016-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013147589-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014084175-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014036097-A |
priorityDate |
2009-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |