| abstract |
The present invention provides a resin composition capable of obtaining a cured product having a small dimensional change due to heat, and a B-stage film, a laminated film, a copper-clad laminate, and a multilayer substrate using the resin composition. A resin composition containing a cyanate ester resin, a bisphenol F-type epoxy resin, a phenoxy resin, and a filler, and a B stage film, a laminated film, a copper-clad laminate using the resin composition, and Multilayer board. [Selection figure] None |