| abstract |
An LED lead frame having a reflective film that can maintain a high reflectance for a long period of time and can be formed stably and easily is provided. Through a substrate 11 made of copper or a copper alloy and an Ag plating film 12 formed on the surface, Ge: 0.06 to 0.5 at% and Bi: 0.02 to 0.2 at% are contained. A lead frame 10 for LED formed by laminating an Ag alloy film 13 to be contained, and the Ag alloy film 13 is formed by a sputtering method, whereby Ge and Bi are concentrated on the surface, thereby providing heat resistance and halogen resistance. And imparts sulfidation resistance. Furthermore, the thickness of the Ag alloy film 13 that is difficult to increase in thickness is limited to 20 to 500 nm, and the total thickness with the Ag plating film 12 is 0.6 μm or more, so that Cu diffuses from the substrate 11 to the surface. To prevent discoloration. [Selection] Figure 1 |