| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2009-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6944753641cb446cead234ffccabfa0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_406996eb017d60b81ebaaf80fec47531
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cf2b996763a7a37c56c89ac5fb81b2c |
| publicationDate |
2011-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011023507-A |
| titleOfInvention |
Dicing die attach film, manufacturing method thereof, and semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide a dicing die attach film capable of picking up an IC chip with a sufficiently high adhesive force while being picked up with a small load, a manufacturing method thereof, and a semiconductor device using the same. A dicing die attach film is formed by laminating a pressure-sensitive adhesive layer and an adhesive layer in this order on a sheet substrate, and the adhesive layer is composed of two or more adhesive constituent layers. The first adhesive constituent layer in contact with the pressure-sensitive adhesive layer in the adhesive layer is made of a semi-cured resin composition. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016140308-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016140308-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013222850-A |
| priorityDate |
2009-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |