http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011017034-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-13
filingDate 2009-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21304090c699ff105b9969c223642d95
publicationDate 2011-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011017034-A
titleOfInvention Sputtering apparatus and liquid crystal device manufacturing apparatus
abstract In a reactive sputtering apparatus in which sputtering particles are supplied from an oblique direction of a substrate, a sputtering apparatus capable of ensuring a good film formation rate is provided. A film forming chamber 2 having a substrate holder 6 for holding a substrate W and capable of transporting the substrate holder 6 and a sputtering chamber 3 communicating with the film forming chamber 2 and having a target 10 disposed therein are provided. A sputtering apparatus for forming a reaction product film on a substrate W by a reaction between sputtering particles discharged from the sputtering chamber 3 to the film formation chamber 2 and a reaction gas. A box 20 having a hole larger than the outer periphery of the target 10 is provided in the sputtering chamber 3, and the surface of the target 10 faces the inner surface of the box 20 through the first opening 21 of the box 20, A second opening 22 through which the sputtered particles pass is provided in a part of the surface of the box 20 facing the target 10. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104131257-A
priorityDate 2009-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 19.