| abstract |
An adhesive sheet that acts as a dicing tape in a dicing process and acts as an adhesive sheet having excellent connection reliability in a joining process between a semiconductor element and a support member, a semiconductor device using the adhesive sheet, and a method of manufacturing the same The purpose is to provide. An adhesive layer containing (A) an epoxy resin and an epoxy resin curing agent, and (B) a high molecular weight component having a weight average molecular weight of 100,000 or more, and a pressure-sensitive adhesive layer containing a radiation polymerizable compound. , And a base material layer, the adhesive strength between the adhesive layer and the pressure-sensitive adhesive layer before radiation irradiation is 200 mN / cm or more, and 5.1 mmΦ of the adhesive layer in an uncured or semi-cured state Provided are an adhesive sheet having a tack strength at 25 ° C. of 0.5 N or more by probe measurement, a semiconductor device using the adhesive sheet, and a manufacturing method thereof. [Selection] Figure 3 |