| abstract |
Provided is a multilayer wiring board capable of increasing the density of wiring patterns corresponding to narrowing the pitch of connection terminals of an integrated circuit and improving the connection reliability of wiring patterns between layers. A multilayer wiring board of the present invention includes a laminated body formed by laminating a plurality of ceramic layers, and a wiring pattern provided in the laminated body. The ceramic layer includes: As the wiring pattern 12, a through-via-hole conductor 17 that vertically penetrates the ceramic layer 11A, and a semi-through-continuous via-hole conductor 17A that is electrically connected to the through-via-hole conductor 17 within the same ceramic layer 11A and does not penetrate the ceramic layer 11A , And the width of the semi-through continuous via-hole conductor 17 </ b> A is narrower than the width of the through-via hole conductor 17. [Selection] Figure 2 |