http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011006593-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 |
| filingDate | 2009-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91fb2af1e50966203cc7c7e7c63f0d27 |
| publicationDate | 2011-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011006593-A |
| titleOfInvention | Curable resin composition, cured product thereof, printed wiring board |
| abstract | The present invention provides a curable resin composition that achieves excellent heat resistance, low dielectric constant, and low dielectric loss tangent in the cured product, the cured product, and a printed wiring board that combines these performances. The following structural formula (i) [Chemical 1] (In the formula, each R 1 independently represents a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 2 carbon atoms.) A cyanate ester resin (A) having a skeleton in which a naphthalene structure and a cyclohexadienone structure are knotted via a methylene group, a cyanate group, represented by a skeleton represented by the formula: (B) is an essential component. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109749440-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3012294-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016128574-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016117670-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013108025-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105378962-A |
| priorityDate | 2009-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.