http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011003682-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0886d990612a64b2c2040e9779f38ba7 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
filingDate | 2009-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1399fd4f15f400726407bb8db15ee49 |
publicationDate | 2011-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2011003682-A |
titleOfInvention | Car electronics |
abstract | There is a problem that when a condensation type seal is used as a sealing material for a base and a cover of an in-vehicle electronic device, curing is slow and productivity is deteriorated. A vehicle-mounted electronic device having a base for dissipating heat from an electronic component and installing a circuit board, and mounting the substrate on which the circuit board is formed by mounting the electronic component is mounted on the base. In an electronic device, a through hole is provided in the cover on the sealing surface of the base and the cover so that the sealing material protrudes. [Selection] Figure 6 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013105766-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014003206-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2902133-A1 |
priorityDate | 2009-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.