| abstract |
The present invention includes, but is not limited to, a substrate surface treatment method, as well as the method and films, coatings and equipment obtained from the method, including the manufacture of electronic equipment, the manufacture of printed circuit boards, metal electroplating, It relates to the use in various applications such as the protection of surfaces against chemical erosion, the manufacture of localized conductive coatings, for example the manufacture of chemical sensors in the chemical and molecular biology fields, the manufacture of biomedical devices and the like. In another aspect, the invention relates to a printed circuit board comprising at least one metal layer, a layer of organic molecules attached to the at least one metal layer, and an epoxy layer on the layer of organic molecules. |