| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4053 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate |
2008-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2010-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010529667-A |
| titleOfInvention |
Circuit board manufacturing method |
| abstract |
To connect a conductive surface of a circuit board with a plurality of circuit boards, in particular a circuit board with at least two conductive surfaces and holes separated by an insulator layer, or to make a conductor on the board in a conductive manner the method of. In this method, a metal or alloy in powder form is provided and the powder is sintered using a laser to create a unified conductive structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9585251-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016072011-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016072011-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015145848-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015195329-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016128189-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016039171-A |
| priorityDate |
2007-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |