| abstract |
According to one embodiment of the present disclosure, a method for producing a protective film for a circuit element generally includes providing a substrate having a substrate surface, producing an electrical component on the substrate surface, and the substrate surface and Coating the electrical component with a first protective dielectric film. The first protective dielectric film generally has a moisture permeability of 0.01 g / m 2 / day, a moisture absorption rate of less than 0.04%, a dielectric constant of less than 10, a dielectric loss of less than 0.005, and a breakdown voltage strength of 8 × 10 6 V / Made of a material that is insoluble in water vapor with a sheet resistance greater than cm, a sheet resistance of 10 15 Ω-cm, and a defect density of less than 0.5 / cm 2 . |