| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be4eba9539585114cd0e90a237a5246a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c271097880554b38672a0f8534a3c3c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48471
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
2009-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f67c7ba86ca981751fcdc5fb708570e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbfca756dc81bdc720ac1b0f70de6d12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55390263a5bb4c65251c2507c2fc002a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b95713298bb4158035430f3243da6d1e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cab6481b02582a8e4db2985c61b26cbd |
| publicationDate |
2010-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010287741-A |
| titleOfInvention |
Lead frame, manufacturing method thereof, and semiconductor device |
| abstract |
To improve adhesion between a silver plating layer and a mold resin in a lead frame. “Providing a reliable semiconductor layer. A lead frame includes a die pad portion for fixing a semiconductor chip, an inner lead portion, and an outer lead portion. At least on the surface of the wire bonding portion 23a of the inner lead portion 23, a base silver plating for depositing silver crystal nuclei and a silver plating layer 28 having a roughened surface by two-step silver plating of the main silver plating are formed. Become. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/IT-201600086321-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017117948-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110731129-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019512880-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3285295-A1 |
| priorityDate |
2009-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |