http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010287540-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14
filingDate 2009-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32398babfc4d319b5e2d6426e87a11b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5d170f64108a7cea8b3223a55dda57e
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publicationDate 2010-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010287540-A
titleOfInvention Production method of transparent conductive pattern and substrate with transparent conductive pattern
abstract A method for producing a transparent conductive pattern capable of forming a conductive pattern with low pattern recognizability by a simple method without using a wet etching method is provided. A step of applying a resin solution containing a metal nanofiller to the surface of a transparent substrate 1 to form a transparent conductive film 2 containing the metal nanofiller. A step of disposing a mask 4 having a pattern-like opening 3 formed on the surface of the transparent conductive film 2. A plasma treatment or a corona treatment is performed from the opposite side of the transparent conductive film 2 of the mask 4 to forcibly oxidize the metal nanofiller in the transparent conductive film 2 in a portion corresponding to the opening 3 of the mask 4. Forming the non-conductive portion 5 in the transparent conductive film 2 with the metal nanofiller and forming the conductive portion 6 with the non-oxidized metal nanofiller. A transparent conductive pattern is prepared by including these steps. [Selection] Figure 1
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