| abstract |
The present invention provides a heat-resistant polyamide resin suitable for packaging materials that require heat sterilization and materials for automobiles, electrical machinery, and electronic parts that require high heat resistance. A polyamide resin comprising a diamine component containing 40 mol% or more of bis (aminomethyl) cyclohexane and a dicarboxylic acid component containing 50 mol% or more of isophthalic acid and / or terephthalic acid. [Selection figure] None |