http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010278461-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
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filingDate 2010-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38eaa86630f85fa3d10571c45d36c02e
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publicationDate 2010-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010278461-A
titleOfInvention Wafer heating device
abstract In a wafer heating apparatus for supporting a wafer on a heat equalizing plate, if the mounting surface of the heat equalizing plate becomes concave, a gap between the heat equalizing plate and the wafer increases near the center. When the temperature setting is changed or when the wafer is replaced, the heating of the central part is delayed at the time of temperature rise transient, resulting in a problem that the temperature distribution in the wafer surface becomes large. A power feeding section having one main surface of a soaking plate made of ceramics as a wafer mounting surface, a heating resistor on the other main surface or inside, and electrically connected to the heating resistor. In the other main surface, the mounting surface of the soaking plate is made convex. [Selection] Figure 1
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Total number of triples: 34.