abstract |
[PROBLEMS] To improve storage stability, adhesion, bendability, filling property, and flame retardancy, and to improve heat resistance and chemical resistance by suppressing a decrease in glass transition point (Tg). Provided is an epoxy resin composition for printed wiring boards. The present invention relates to an epoxy resin composition for printed wiring boards. (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a carbodiimide-modified soluble polyamide, and (D) a melamine flame retardant are contained as essential components. [Selection figure] None |