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publicationDate 2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010270262-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation, and semiconductor device in which a semiconductor element is encapsulated using the composition
abstract Provided is an epoxy resin composition in which the melt viscosity at the time of transfer molding can be suppressed to a relatively low value even when the content of the inorganic filler is increased for imparting flame retardancy. In an epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a curing agent and an inorganic filler, the surface of the inorganic filler is coated with a release agent layer by mechanical surface treatment. . The inorganic filler is preferably contained in the epoxy resin composition for semiconductor encapsulation in an amount of 87 to 90% by weight. [Selection figure] None
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