Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 |
filingDate |
2009-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0192bba9f0b76f20fafe36f4208ead5b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3c002bf457678ca184667ce7192a59d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8122df91d1d64d286a50e8098f8ebf6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9e7cd463aeeea79b2bb9d0e4561d7b0 |
publicationDate |
2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2010270262-A |
titleOfInvention |
Epoxy resin composition for semiconductor encapsulation, and semiconductor device in which a semiconductor element is encapsulated using the composition |
abstract |
Provided is an epoxy resin composition in which the melt viscosity at the time of transfer molding can be suppressed to a relatively low value even when the content of the inorganic filler is increased for imparting flame retardancy. In an epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a curing agent and an inorganic filler, the surface of the inorganic filler is coated with a release agent layer by mechanical surface treatment. . The inorganic filler is preferably contained in the epoxy resin composition for semiconductor encapsulation in an amount of 87 to 90% by weight. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015178636-A |
priorityDate |
2009-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |