http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010267686-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81805 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2009-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74189e0992cde33e7fc0a70cc1fa2040 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52e6469a4fa4d6d9d1ec47c3a76a461c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c3fdbebbe8ca4b7140213b81defc9ca |
| publicationDate | 2010-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010267686-A |
| titleOfInvention | Semiconductor device and manufacturing method thereof |
| abstract | Even when a bump electrode of a semiconductor element is bonded onto an inner lead after a resin is applied to the surface of a tape base material, the bonding yield is not affected by the resin residue on the bonding surface between the bump electrode surface and the inner lead. And it aims at improving joining reliability. A concave portion is formed in a protruding electrode on the surface of a semiconductor element, and an inner lead formed on a wiring substrate is bonded to the concave portion of the protruding electrode. Even in this case, the resin 8 can be allowed to escape into the recess of the bump electrode 7 so that the peripheral portion of the recess of the bump electrode 7 and the inner lead 2 can be bonded to each other at one or more locations. Therefore, high yield and high reliability bonding is possible. [Selection] Figure 1 |
| priorityDate | 2009-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452198021 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57420512 |
Total number of triples: 21.