| abstract |
Disclosed is a plating resist capable of fine wiring that has good adhesion to an electroless plating surface, is easy to remove a photocured plating resist under an alkaline condition, and does not reattach. A radical polymerizable compound (A), a polyfunctional thiol compound (B), a hydrophilic polymer (C), a light containing two or more organic groups (a) represented by the following general formula in one molecule It contains radical polymerization initiator (D) and acid generator (E) as essential components, can be patterned by light irradiation and alkali development, and is alkali-dissolved by heat-treating the light-irradiated part at 100 ° C or higher. Photosensitive resin composition (Q), characterized in that [Selection figure] None |