http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010265380-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e443fcd44793752f156437bbfd4c8603
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06
filingDate 2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26f7dbc522755a3a28b6fd4266628559
publicationDate 2010-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010265380-A
titleOfInvention Thermoplastic resin composition and molded article thereof
abstract The present invention provides a thermoplastic resin composition having high thin-wall fluidity and capable of suppressing discoloration of a molded piece upon heat exposure. A thermoplastic resin composition comprising a polyamide having an alicyclic structure, a polyphenylene ether, and a compatibilizer for the polyamide and the polyphenylene ether, wherein the polyamide has 20 cyclohexanedicarboxylic acid units. ˜100 mol% of a dicarboxylic acid unit and a diamine unit containing an aliphatic diamine unit having 6 to 12 carbon atoms, and the polyphenylene ether contains 60% by mass of a component having a molecular weight of 30000 or less. %, And the content of the component having a molecular weight of 3000 or less is 5% by mass or less. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103314034-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013115072-A1
priorityDate 2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008149862-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004263188-A
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Total number of triples: 38.