http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010263243-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-80 |
filingDate | 2010-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee89c506493ff4561ff29bb9b525299d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_860ae5e35e5935ed3ee9118d6fc69183 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04dd618f5666a122112af8cdbe0e43d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2e3f64c0684ecb3cba3deaa1b086a92 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6030b5a0c7ea057733dff3f5f640f9b2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb185cc0633557238516b17d2e2f5dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_736a31c1f4120fba3985a4b8b9a3319b |
publicationDate | 2010-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2010263243-A |
titleOfInvention | Group 3-5 compound semiconductor |
abstract | A structure in which a conductive material having a specific pattern shape that can be used as an embedded electrode in a nitride-based compound semiconductor is realized, and a device such as SIT can be manufactured. (1) a first group 3-5 compound semiconductor having a structure in which GaAlN is laminated on a GaN layer; and (2) a part of the surface of the first group 3-5 compound semiconductor in contact therewith. A conductive material that covers the surface of the first group 3-5 compound semiconductor that is not covered with the conductive material, and a conductive material that covers the conductive material in general. And a second group 3-5 compound semiconductor represented by the formula In u Ga v Al w N (where u + v + w = 1, 0 ≦ u ≦ 1, 0 ≦ v ≦ 1, 0 ≦ w ≦ 1). A Group 3-5 compound semiconductor in which the layer thickness of the conductive material is 5 nm or more and 100 nm or less . [Selection] Figure 1 |
priorityDate | 1999-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.