http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010262962-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
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filingDate 2009-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea007c9abdc4c62f4e3b8a35b05105c1
publicationDate 2010-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010262962-A
titleOfInvention Printed wiring board using pyridobisimidazole fiber
abstract [PROBLEMS] To provide pyridobisimidazole having excellent heat resistance, flame retardancy, low linear expansion coefficient, excellent workability during production of printed wiring boards, and excellent electrical insulation properties, such as polybenzazole fiber. A printed wiring board using fibers is provided. In an electron beam diffraction pattern obtained from a surface layer portion (surface to 1 μm) of pyridobisimidazole fiber, a diffraction peak area derived from a crystal (200) plane in an equatorial profile is represented by S1, a crystal (110) plane, When the diffraction peak area derived from the (210) plane and the (400) plane is S2, S2 / S1 is an existing state of pyridobisimidazole crystals satisfying 0.1 to 1.5, and the atomic force The printed wiring board using the pyridobisimidazole fiber whose mean square roughness of the fiber surface measured with a microscope is 20 nm or less. [Selection] Figure 1
priorityDate 2009-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.