http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010258064-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_435f7fafc4b931eae59de228af7272de |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-028 |
filingDate | 2009-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c82249791252498d423bb8ac1510dfcc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e7342716bb8c0918f2d248aa4b4531f |
publicationDate | 2010-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2010258064-A |
titleOfInvention | Semiconductor device and manufacturing method thereof |
abstract | An object of the present invention is to provide a semiconductor device and a method of manufacturing the same, in which the process is stabilized and the reliability is improved while realizing a simple manufacturing process. A semiconductor device includes a semiconductor layer (20) including an active layer (12) and a striped ridge (14) formed on a substrate (10), and an electrode (15) formed on the ridge (14). The electrode 15 is in contact with the semiconductor layer 20 only on the upper surface of the ridge 14 and is wider than the upper surface of the ridge 14, and the protective film 16 having an opening on the upper surface of the ridge 14 is formed. A semiconductor element formed. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9705286-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020047635-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7246038-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012059890-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014005502-A1 |
priorityDate | 2009-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.