| abstract |
Disclosed is a silicone resin composition for an optical semiconductor device, which is excellent in warpage of a semiconductor device due to curing, adhesiveness after temperature cycling and crack resistance, and excellent in whiteness, heat resistance and light resistance. A silicone resin composition comprising: (A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of 1000 to 20000 (CH 3 ) a Si (OR 1 ) b (OH) c O (4-abc) / 2 (B) White pigment 3 to 200 parts by mass (C) Inorganic filler 400 to 1000 parts by mass other than the white pigment (D) Condensation catalyst 0.01 to 10 parts by mass (E) Isocyanuric acid derivative epoxy resin 0 to 10 parts by mass (F) 2 to 50 parts by mass of organopolysiloxane having 0.5 to 10 mol% of all siloxane units having a silanol group (G) A linear diorgano represented by the following formula (2) 2-50 parts by weight of polysiloxane. [Selection figure] None |