http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010242064-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
filingDate 2010-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e04c66845bd0d64faf434f3563eb426c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de2f46f944ce73ce7949d5bb775a00f1
publicationDate 2010-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010242064-A
titleOfInvention Method for producing interpenetrating polymer network structure and polishing pad
abstract An interpenetrating network polymer structure having high heat resistance, a method for producing the same, and a polishing pad comprising the structure are provided. [MEANS FOR SOLVING PROBLEMS] (1) A step of immersing a polymer molded body in a radical polymerizable composition A comprising an ethylenically unsaturated compound A, a radical polymerization initiator A, and a chain transfer agent A, and impregnating the radical polymerizable composition A A step of polymerizing the ethylenically unsaturated compound A under the swollen state of the polymer molded body, a polymer molded body polymerized with the ethylenically unsaturated compound A is further converted into an ethylenically unsaturated compound B, a radical polymerization initiator B, Step of immersing in radical polymerizable composition B comprising chain transfer agent B, ethylenically unsaturated compound under swelling state of polymer molded body polymerized with ethylenically unsaturated compound A impregnated with radical polymerizable composition B A method for producing an interpenetrating polymer network structure comprising the steps of polymerizing B in this order, and a polishing pad comprising the interpenetrating polymer network structure. [Selection figure] None
priorityDate 2009-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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