| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2010-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_049e6b35e4bd100c394ab5f1b888ad8a |
| publicationDate |
2010-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010239153-A |
| titleOfInvention |
Manufacturing method of semiconductor device |
| abstract |
Provided is a method for connecting a semiconductor chip, which can provide a good temporary sticking property to an anisotropic conductive film and can provide a good connection reliability. An anisotropic conductive film 10 temporarily attached to a wiring board has a width of a release film 1 as W1, a width of an insulating adhesive layer 2 as W2, and a width of an anisotropic conductive adhesive layer 3 as W3. Then, the correlation between the width of the insulating adhesive layer and the width of the anisotropic conductive adhesive layer is as follows: width W1 of the release film 1> width W2 of the insulating adhesive layer 2> width W3 of the anisotropic conductive adhesive layer 3. Satisfied. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016052130-A1 |
| priorityDate |
2010-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |