abstract |
A curable resin composition having good workability, high sensitivity, and capable of obtaining high reliability when used in, for example, a printed wiring board or a semiconductor package, Provision of the cured product. SOLUTION: A reaction product obtained by reacting a phenol resin with an alkylene oxide or a cyclocarbonate compound in a curable resin composition is reacted with an unsaturated group-containing monocarboxylic acid. It contains a carboxyl group-containing photosensitive resin obtained by reacting a polybasic acid anhydride and a photopolymerization initiator. [Selection figure] None |