| abstract |
In a sensor device in which a sensor chip having a sensing unit for detecting a mechanical quantity mounted on a substrate is sealed with a sealing member, the stress generated on the sensor chip by the sealing member is reduced as much as possible. To do. A method of manufacturing a sensor device in which a sensor chip having a sensing portion on its surface is mounted on one side of a substrate, and then the sensor chip and the substrate are covered with a sealing member and sealed. In addition, the sensor chip 10 is mounted on one surface side of the substrate 20, a volatile resin 50 is disposed on the surface of the sensor chip 10, and the surface is covered with the resin 50. 20 is sealed by the sealing member 30, and then the sealing member 30 is cured and the resin 50 is heated and volatilized to seal the portion of the surface of the sensor chip 10 covered with the sealing member 30. A gap 40 is provided between the stopper member 30 and the stopper member 30. [Selection] Figure 2 |