| abstract |
The present invention provides a method for manufacturing a ceramic substrate, which has high thermal conductivity, excellent electrical characteristics, high reliability, strong bonding strength, and can reduce manufacturing costs. The present invention provides a method for metalizing a ceramic substrate. Since the ceramic substrate 1 is an inorganic substance and does not have an electrical polarity, it is very difficult to bond with a metal. Therefore, using the manufacturing process of plating, first, the ceramic substrate 1 is cleaned, and the surface of the ceramic substrate 1 is roughened by microetching. Next, a surface active agent 2 containing nano-level Si is applied to the surface of the ceramic substrate 1 to generate a negative electrical polarity on the surface of the ceramic substrate 1 having no electrical polarity. Next, a positively charged first metal layer 3 that is thin and easily bonded to the ceramic is deposited on the nanosurfactant 2 through a plating process. [Selection] Figure 2 |