http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010225650-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
filingDate 2009-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef14b63e77adc9139867a94be2d86ec1
publicationDate 2010-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010225650-A
titleOfInvention Dicing tape and semiconductor chip manufacturing method
abstract A dicing tape used for dicing a semiconductor wafer to obtain a semiconductor chip, in which a release layer can be easily peeled off from an adhesive portion of an intermediate layer, and thus workability at the time of peeling can be improved. Provide dicing tape. An intermediate layer includes an intermediate layer, a release layer disposed on one side of the intermediate layer, and a dicing layer stacked on the other surface of the intermediate layer. However, the adhesive part 4B having adhesiveness is provided in at least a part of the intermediate layer 4, and the release layer 2 and the adhesive part 4B of the intermediate layer 4 are attached to each other. The dicing tape 1 whose storage elastic modulus in 23 degreeC of 4B is 1 * 10 < 4 > Pa or more. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10508224-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017104478-A1
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priorityDate 2009-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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