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filingDate 2010-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08440c0dc5fccb85ff3161ff49be50c1
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publicationDate 2010-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010223964-A
titleOfInvention Defect inspection apparatus and method
abstract In semiconductor manufacturing or magnetic head manufacturing, scratches having various shapes generated on the surface of an object to be processed (for example, an insulating film on a semiconductor substrate) when polishing or grinding such as CMP is performed. It is an object of the present invention to provide a defect inspection apparatus and method capable of discriminating and inspecting particles and foreign particles adhering thereto. A defect inspection apparatus irradiates a surface of an inspection object with a first illumination system that irradiates the surface of the inspection object with a first UV light and a second UV light obliquely with respect to the surface of the inspection object. A second illumination system; detection optical system means for collecting and detecting scattered light from the object to be inspected by a condenser lens; and an arithmetic processing unit for processing the detection signal to discriminate defects. The reflection mirror of the first illumination system is disposed between the condenser lens and the stage on the optical axis of the condenser lens to reflect the first UV light incident from the direction parallel to the surface of the inspection object. It was configured to irradiate the surface of the object to be inspected from the vertical direction by reflecting with a mirror. [Selection] Figure 1
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Total number of triples: 27.