| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_440b3059c9bcd1d85fd383f9b2ae1b40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ee316441a1c1c88bd60d306365c3b9c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-44 |
| filingDate |
2009-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81d3d747233f12309dad1839ab232ea7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4977a7198913f82313b8edc660ead8b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34bd11f2db29d3b7f161fcdc3598ef81 |
| publicationDate |
2010-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010205955-A |
| titleOfInvention |
Thermally conductive electronic circuit board, electronic device using the same, and manufacturing method thereof |
| abstract |
PROBLEM TO BE SOLVED: To provide a metal-based electronic circuit board that uses a conductive substrate made of a metal such as aluminum and satisfies two contradictory requirements of insulation and thermal conductivity. A thermally conductive electronic circuit board is a substrate on which an electronic circuit is formed, a conductive substrate serving as a heat conductor for diffusing heat generated in the electronic circuit element, and a surface of the conductive substrate. A heat conductive insulating film 120 having insulation and heat conductivity formed by applying and drying an insulating / heat conductive paint on the surface, an electronic circuit pattern 130 and an electron formed on the surface of the heat conductive insulating film 120 A circuit element 140 is provided. The thermally conductive insulating film 120 has excellent insulating properties and thermal conductivity, can provide sufficient insulation to the electronic circuit pattern 130 even with a thin film thickness, has good thermal conductivity, and is thin. Therefore, it does not become a thermal resistor, but the heat generated in the electronic circuit element is efficiently conducted from the electronic circuit pattern 130 to the conductive substrate 110 and dissipated outside the system. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10681808-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10256188-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9554464-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014021427-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10811334-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11004680-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10790228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013004822-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10529641-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11676880-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013038360-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012176581-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10861763-B2 |
| priorityDate |
2009-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |