| abstract |
In a semiconductor device in which a plurality of semiconductor chips are stacked, a semiconductor device capable of reducing warpage of a substrate and suppressing a decrease in connection reliability is provided. A semiconductor device includes a first resin substrate having a first semiconductor chip mounted on a surface, a second resin substrate having a second semiconductor chip mounted on a surface, and a first resin substrate. A resin base material 109 that is bonded to the front surface and the back surface of the second resin substrate 111 to electrically connect them is included. The resin base material 109 is disposed on the outer periphery of the first resin substrate 101 on the surface of the first resin substrate 101. Further, on the surface of the first resin substrate 101, the first semiconductor chip 125 is disposed in a gap provided between the first resin substrate 101, the second resin substrate 111, and the resin base material 109. [Selection] Figure 2 |