| abstract |
Photosensitive resin composition having good sensitivity, resolution, adhesion, resist shape, release property after curing, and sludge removability, photosensitive element using the same, resist pattern forming method and printing A method for manufacturing a wiring board is provided. (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator containing a hexaarylbiimidazole compound, and (D) a compound represented by the following general formula (4). A photosensitive resin composition containing a sensitizing dye. [Selection figure] None |