| abstract |
The present invention provides a resin composition that provides a cured resin having high electrical insulation and thermal conductivity, and provides a cured resin having high electrical insulation and thermal conductivity. A resin composition comprising a rigid unit 1 including a benzoxazole structure, a benzothiazole structure or a benzimidazole structure, a flexible unit 2 bonded to both ends of the rigid unit, and a compound having a terminal polymerizable group. . Also, a cured resin obtained by polymerizing the above resin composition. [Selection] Figure 1 |