| abstract |
【Task】 Provided are an epoxy resin composition using an epoxy resin having a specific structure, and a prepreg using the epoxy resin composition, the cured product of which has high thermal conductivity. [Solution] Formula (1) (In the formula, each R independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a trifluoromethyl group, an aryl group, or a methoxy group), an epoxy resin, a curing agent, and a thermal conductivity. A cured product of the epoxy resin composition containing an inorganic filler of 20 W / m / K or more showed high thermal conductivity. [Selection figure] None |