http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010192784-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2009-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4dc36bb687db6f29592cd6db704cf671 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5a54a96d925d55d9e3cc04346364d4e |
| publicationDate | 2010-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010192784-A |
| titleOfInvention | Wiring board, probe card and electronic device |
| abstract | PROBLEM TO BE SOLVED: To provide a highly reliable wiring board in which the possibility that a wiring breaks is further reduced even if a thermal stress is generated between an insulating resin layer and a ceramic wiring board. SOLUTION: A ceramic wiring substrate 1, a plurality of insulating resin layers 2 laminated on the upper surface of the ceramic wiring substrate 1, a wiring layer 3 on each upper surface of the plurality of insulating resin layers 2, and above and below the insulating resin layer 2. Via conductors 4 connecting between the wiring layers 3 and 3 positioned and the upper surface of the lowermost insulating resin layer 2 reach into the ceramic wiring substrate 1, and the upper wiring layer 3 and the ceramic wiring on the lowermost insulating resin layer 2 A wiring board comprising a through conductor 6 for connecting an external wiring 7 a on the upper surface of the board 1. Since the interface between the ceramic wiring board 1 and the lowermost insulating resin layer 2 where the thermal stress is increased does not have a connection portion between the end face of the via conductor 4 having a relatively low connection strength and the external wiring 7a, the wiring breaks. Thus, a highly reliable wiring board in which the possibility of occurrence is reduced is obtained. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015002227-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014107390-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015185773-A |
| priorityDate | 2009-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.