http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010189591-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3432 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2009-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51f3484001badf0ea07275db4cb54f0e |
| publicationDate | 2010-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010189591-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract | The present invention provides a sealing epoxy resin composition that improves the drawbacks of a conventional epoxy resin composition for encapsulating semiconductors and is excellent in both adhesion and reflow crack resistance. In an epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a phenol resin curing agent, an inorganic filler and a silane coupling agent as essential components, 2,4-dihydroxypyridine is preferably used as an additive, preferably a semiconductor. It is made to contain 0.1-1.5 mass% in the ratio which occupies in the epoxy resin composition for sealing. [Selection figure] None |
| priorityDate | 2009-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.