| abstract |
An object of the present invention is to provide a light-reflective thermosetting resin composition having sufficiently high heat resistance and excellent optical characteristics required for a substrate for mounting an optical semiconductor element. [Solution] (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst and (D) a white pigment, and (B) a curing agent represented by the following general formula (1) A thermosetting resin composition for light reflection, comprising: In Expression (1), R 1, R 2, R 3, R 4, R 5 and R 6 are each independently a monovalent hydrocarbon group having a hydrogen atom or 1 to 10 carbon atoms, and R 1 R 2 , or R 4 and R 5 may be connected to each other to form a ring, and R 7 , R 8 , R 9 and R 10 are each independently monovalent having 1 to 10 carbon atoms. M represents an integer of 1 to 100. ] [Selection figure] None |