| abstract |
PROBLEM TO BE SOLVED: To embed an inorganic compound or the like on the surface of a resin particle, or to carry an inorganic compound or the like on a porous polymer particle, depending on the kind of the solvent or the like coexisting with the resin particle or the porous polymer particle, There has been a problem that the supported inorganic compound may easily fall off from the resin particles or the porous polymer particles. A resin particle having a number average particle diameter of 1 to 100 μm in which an inorganic compound is encapsulated in a plurality of locations. After the inorganic resin is supported on the porous resin particles, it is preferable to reduce the pores or close the pores. [Selection] Figure 2 |