http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010169808-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2009-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bd8d5d064e87222cb998168a08fb536 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fb90da9118934a9d31f7e9137b7f878 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f4c53372172e3709a48ae111dd7ce1b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fedac687d04a5a0eccf7b5a3dde3403e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b9c6b4299f279b9953a8a3de12cfc90 |
| publicationDate | 2010-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010169808-A |
| titleOfInvention | Photosensitive resin composition, photosensitive film, permanent mask resist and method for producing the same |
| abstract | PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, a photosensitive film, a permanent mask resist, and a method for producing the same, which are excellent in stability (pot life) of a photosensitive resin composition, folding resistance of a cured film and plating resistance. (A) an acid-modified vinyl group-containing epoxy resin, (B) a binder polymer containing (meth) acrylic acid and (meth) acrylic acid butyl ester as constituent monomers, (C) a photopolymerizable compound, and (D) ) A photosensitive resin composition containing a photopolymerization initiator, the acid value of the binder polymer containing (B) (meth) acrylic acid and (meth) acrylic acid butyl ester as constituent monomers is 50 to 130 mgKOH / The photosensitive resin composition which is g. [Selection] Figure 1 |
| priorityDate | 2009-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 165.