http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010168506-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 |
| filingDate | 2009-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0192bba9f0b76f20fafe36f4208ead5b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8122df91d1d64d286a50e8098f8ebf6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3c002bf457678ca184667ce7192a59d |
| publicationDate | 2010-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010168506-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation, and semiconductor device |
| abstract | An object of the present invention is to obtain an epoxy resin composition having excellent flame resistance and sufficiently low viscosity without using a flame retardant such as a halogen-based flame retardant and without containing a large amount of an inorganic filler. And An epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, wherein the epoxy resin is a phenylphenol novolac type epoxy resin having a specific structure; And an epoxy resin composition characterized in that the content of the phenylphenol novolac epoxy resin is 40 to 80% by mass with respect to the total amount of the epoxy resin. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011140539-A |
| priorityDate | 2009-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.